Technical Ceramics
Semiconductor Processing
Morgan Technical Ceramics is a global market leader and specialises in supplying materials and components for manufacturing processes of semiconductors and other high quality demanding markets such as LED displays for more than 30 years.
Get a quoteSemiconductor Applications
Morgan products are used in fabrication plants all over the world and helping semiconductor manufacturers to optimise their processes, increase production yield and help to reduce their total cost of ownership. We provide application engineering support and consistent quality at both prototype and production volumes.
Our semiconductor components are used in applications including:
Wafer Production
High purity SiC source material for SiC boule product from which SiC wafers are produced
Deposition
Chamber liners
Edge rings
Gas mixing manifolds
Isolator and shield rings
Lift pads and pins
Plasma tubes
Dry Etch
Electrostatic chuck top layers
Focus ring
Showerheads, gas distribution plates
Ion-implant
Shield rings
Lithography
Lamp covers
Plasma tubes and light-source components
Thermal heat sinks
Wafer chucks
MOCVD
Chamber components (e.g. wafer carriers, wafer susceptors)
Wafer Handling
Charge dissipative end effectors
Wafer Inspection
Electrical insulator assemblies
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Semiconductor Products
Our semiconductor components are produced within our own facilities under strict process controls, eliminating third-party material variability that can compromise chamber performance.
We offer a wide range of products for the Semiconductor Process Equipment (SPE) industry including:
- High-purity alumina chamber and lithography components
- High-purity alumina targets
- CVD SiC chamber and lithography components
- CVD SiC targets
- CVD SiC source material for growing single-crystal boules or ingots
- High-purity alumina, ultra-high surface roughness coating
Semiconductor Materials
Our materials offer:
- Ultra-pure 99.999% (by GDMS) - setting the standard for plasma resistance and low particle shedding
- Plasma resistance
- Low-particle shedding
- High purity
- High temperature dielectric performance
- High Weibuell modulus aluminas
Semiconductor Processing Ceramics Questions
How is ceramic used in semiconductor processing equipment?
Ceramic components provide a clean surface, dimensional stability and resistance to degradation in semiconductor processing equipment such as chamber linings and rings.
Why are ceramics used in semiconductor processing equipment?
Morgan CVD SiC ceramic material has a unique combination of excellent thermal, electrical and chemical properties that makes it well-suited to applications across semiconductor industries where a high-performance material is required.
What are the advantages of Morgan semiconductor products?
- Ultra-pure 99.999% (by GDMS)
- Outstanding corrosion resistance in plasma applications
- Proven durability in high temperature ammonia environments
- Excellent thermal shock resistant
- High thermal conductivity
- Excellent stiffness to weight ratio
- Fine grained microstructure
- Non-porous
- Two resistivity grades
- HR Grade: >10 Ω-cm
- ELR Grade: <0.1 Ω-cm
What makes CVD SiC superior to sintered SiC for semiconductor process components?
CVD (chemical vapour deposited) silicon carbide is a fully dense, ultra-pure material with no binders or sintering aids that could become sources of contamination in the process environment. Its fine-grained, non-porous microstructure provides superior resistance to plasma etching, minimal particle shedding, and precise, stable dimensional control throughout the component's service life. These properties are critical to maintaining wafer yield in advanced semiconductor fabrication.
How does Morgan ensure the cleanliness required for semiconductor-grade ceramics?/reduce contamination risks?
Our semiconductor-grade CVD SiC achieves purity levels of 99.999% as verified by glow discharge mass spectrometry (GDMS). Components are , inspected, and packaged in controlled environments appropriate to the application. We have extensive experience in meeting the cleanliness protocols required by semiconductor equipment OEMs and fab operations.
