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New Technology

Silicon Nitride for highly demanding thermal and wear applications

Introduction

Morgan Advanced Ceramics, Stourport, England, is unique within the Morgan group in offering Silicon Nitride. The company has over 25 years of experience in the manufacture of Silicon Nitride, with experienced and highly skilled machinists providing solutions to the most demanding of customer requirements.

What is Silicon Nitride?

Silicon Nitride (Si3N4) is a relatively new member of the advanced ceramics family, having been developed in the 1960’s. It is used in many varied applications, but lends itself particularly to applications where high temperatures are involved. This is not limited to continuous temperatures, as with many ceramics, but due to
Si3N4’s exceptional thermal shock resistance, it is also widely used in cyclic thermal applications, for example induction coil supports and fixtures. Silicon Nitride is also resistant to attack by many molten metals leading to its use in metal handling applications.

What is so special about Silicon Nitride?

  • Manufacture by a range of methods to suit volumes from one-off requirements to very high volume applications
  • Excellent wear resistance/hardness
  • Low thermal expansion
  • Good chemical corrosion resistance
  • High temperature performance
  • Good thermal shock behaviour
  • Good flexural strength
  • Low weight
  • High Stiffness
  • Electrically insulating

What are the types of Silicon Nitride?

There are two main types of Silicon Nitride; Reaction Bonded Silicon Nitride (RBSN) and Hot Pressed Silicon Nitride (HPSN). Morgan Advanced Ceramics specialises in the Reaction Bonded Silicon Nitride which, supported by customer endorsements, is considered to be one of the very best on the market.

Reaction Bonded Silicon Nitride

Reaction Bonded Silicon Nitride is quite unique in its manufacture and ability to take advantage of ‘near-net shape’ forming. Components are initially made from very high purity Silicon metal and formed to the desired geometry using a variety of techniques (see table below). Parts are then fired in a Nitrogen controlled environment, which converts the Silicon metal to Si3N4 ceramic, retaining about 20% porosity. Once converted, the component can be further machined to achieve an improved surface finish using specialised diamond tooling. There are no sintering aids used in the manufacture of RBSN leading to the final ceramic having very high purity (>99% Si3N4). Also there is minimal shrinkage during the entire process (~0.1%) and very accurate dimensions can therefore be achieved cost effectively. 

Features of Reaction Bonded Silicon Nitride

  • High purity (>99%) Si3N4
  • Low weight
  • Excellent Thermal Stability
  • Sputter resistant
  • Not wetted by many metal and alloys
  • Excellent thermal shock capability (ie; cycles from RT to 700°C in 7 seconds and repeated every 30 seconds)

What are the forming techniques for Reaction Bonded Silicon Nitride?

A number of factors are considered before choosing the most suitable forming technique. These include complexity of geometry, overall size of the component, quantity required, surface finish and component tolerance. Table 1 below lists some of the typical factors considered with determining the most suitable forming techniques. Note that, although prototype parts cannot be made via the ‘Injection Moulding’ and ‘Die Pressing’ route, prototypes can be made by the ‘Green Machining’ route.

Table 1: - Comparison of forming techniques for Reaction Bonded Silicon Nitride

  Green Machining Injection Moulding Die Pressing Freeze Casting
Part Complexity High High Medium Low
Tolerance High Medium Medium Low
Suitable Volumes Low - Medium Medium – High Medium – High Low - Medium
Prototyping Yes No No Yes
Tooling Cost Very Low Very High High Medium
Part Cost Higher Low Low Medium

Note: cross-section thickness should be no greater than 20mm for green machining, pressing and freeze casting and 6mm for injection moulding.

Hot Pressed Silicon Nitride (HPSN)

Hot Pressed Silicon Nitride (HPSN) is a fully dense Silicon Nitride (i.e. 0% porosity), which is made via a more classical ceramic manufacturing routes. Hot Pressed Silicon Nitride is again a mixture of fine grain Si3N4 and sintering additives, but is formed under high pressure and temperature in a graphite mould to produce a ‘Hot Pressed Billet’. This is then ground to the desired geometry and surface finish. HPSN exhibits the highest mechanical properties of the Silicon Nitride family due to reduction of residual porosity, removed during the Hot Pressing stage.

The choice of material for the specific application is dependant on cost and properties of components required. RBSN is the lowest cost material of the Silicon Nitride family, followed by HPSN. HSPN gives the best mechanical properties, followed closely by RBSN (follow links below to material datasheets). 

Typical Applications of Silicon Nitride:

  • Molten metal handling (including crucible / wear plates)

  • Brazing jigs

  • Induction heating coil supports

  • Reinforcement phase for composites

  • Welding jigs, fixtures and weld location pins

  • Dental heat treatment supports

  • TIG / Plasma welding nozzles

  • Thermocouple sheaths

  • Bearings and rollers

  • Glow plugs

  • Cutting tools

Read more:  

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Silicon Nitride for highly demanding thermal and wear applications

 


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Morgan Technical Ceramics is a Global Business Unit of the Morgan Crucible Company plc.
It comprises Morgan Advanced Ceramics and Morgan Electro Ceramics

Sales Offices/Customer Service:
Europe: Morgan Technical Ceramics, Teplitzerstr.27, D-84478 Waldkraiburg, Germany
UK and Eire: Morgan Technical Ceramics, Bewdley Road, Stourport, Worc DY13 8QR, England
Middle East: Morgan Karbon Grafit Sanayi AS, Ikitelli OSB, Eskoop Sanayi Sitesi, B2 Blok, N.156, 34670 Ikitelli, Istanbul, Turkey
USA: Morgan Technical Ceramics, 232 Forbes Road, Bedford, Ohio 44146-5418, USA 
Asia: Morgan Technical Ceramics, 158 Jiajian Road, Jiading, Shanghai 201818, China